Efficient Thermal Dissipation Media for High Power Electronic Chip Packaging using CNT-Metal Based Composite

Vertically aligned carbon nanotube VA-CNT films were synthesized and a method was developed to transfer the films from a Si to a Cu substrate. The diameters of the CNTs and the thickness of the films were 10-30 nm and 10-30 microns, respectively. LED packages made with VA-CNTs films were tested on an InGaN LED chip. The VA-CNTs film maintained a linear relationship of output light power without reaching saturation for the LED chip of 0.5 W InGaN. The VA-CNTs film greatly increased the input LED current, about more than 500 mA and 350 mA, respectively. A homogeneous distribution of multi-wall MWCNTs in a copper matrix was achieved by a novel processing approach based on the precursor method for synthesis of copper and acid-treated MWCNTs. Dispersion of the CNTs in Cu matrix is important and even determined nanocomposite material properties, such as to enhance the mechanical behavior and wear resistance of the CuCNTs. Successful functionalization of the nanotubes with mixture of acid solution may open new applications in composites field. Hardness and wear resistance of fabricated CuCNTs nanocomposites increased with increasing the mass fraction of CNTs.