Thermal-Electrical FEA of Localized Heating for MEMS Packaging

reportActive / Technical Report | Accession Number: ADA521357 | Open PDF

Abstract:

Localized silicon fusion and eutectic bonding for MEMS packaging have been preliminarily investigated through the U.S. Army SBIR Phase I program entitled Multi- Power Source for MEMS Packaging, contract W56HZV-05-C-0092. This methodology allows localized heating at the bonding area without overheating the temperature-sensitive MEMS device. This paper presents the newly developed three-dimensional finite element analysis FEA of localized heating for MEMS packaging, for analysis of the electrical problem, thermal problem, and the coupling between the two problems. It was confirmed that high temperature is confined and controllable in the heater-on-circuit localized heating technology.

Author(s):
Xie, C. L. ; Hailat, M. ; Newaz, G. ; Mabesa, Jr, J. R.
Author Organization(s):
INNOVATIVE RESEARCH INC PLYMOUTH MN
Supplementary Note:
The original document contains color images. DOI: 10.21236/ADA521357
Pagination:
0009

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
Approved For Public Release; Distribution Is Unlimited.

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
TARDEC-TR-16351
Contract/Grant Number(s):
W56HZV-05-C-0092
Monitor Series:
TR-16351, TARDEC
 Subject Terms
Joint Capability Areas:
JCA_5_Command and Control; JCA_5.3_Planning; JCA_6_Net Centric; JCA_1.2_Force Preparation; JCA_1_Force Support; JCA_8_Building Partnerships
Communities of Interest:
Advanced Electronics
Descriptor(s):
*MICROELECTROMECHANICAL SYSTEMS, HEATING, THERMOELECTRICITY, FINITE ELEMENT ANALYSIS, PACKAGED CIRCUITS
Field(s)/Group(s):
Electrical and Electronic Equipment
Keyword(s):
THERMOELECTRICAL FINITE ELEMENT ANALYSIS, LOCALIZED HEATING, MICROELECTROMECHANICAL SYSTEMS PACKAGING, SILICON FUSION, EUTECTIC BONDING, SBIR(SMALL BUSINESS INNOVATION RESEARCH), SBIR TOPIC A04 256 PHASE 1, SBIR REPORTS
Report Date:
2006 Nov 27
Creation Date:
2010 Jun 16