Optical Interconnect Technology (OIT) Multichip Module to Multichip Module

We have successfully demonstrated the first MCM-to-board-to-MCM optical interconnect based on VCSELs, polymer waveguide, and MCM-C packaging technologies. We demonstrated low-cost component fabrication and passive assembling techniques that are compatible with existing electronic manufacturing processes. We believe these approaches are critical to optical insertion into real system applications. We fabricated flexible polymer waveguide ribbons, board-integrated optical waveguides, and passively aligned flex-to-board waveguide connectors. We also demonstrated optical links based on conventional MCM-C packages with multiple data channels at data rates up to 1 Gbps per channel.