Micro-Time Stress Measurement Device Development.
Abstract:
This report describes the Micro-Time Stress Measurement Device TSMD developed and delivered under this contract. The Micro-TSMD is a microprocessor controlled device to read the installed environmental sensors and record their results in a non-volatile memory. It is contained in a hybrid package about 1 x 1.8 x 0.2 inches, weighing less than an ounce. The TSMD contains sensors for temperature, mechanical vibrationshock, and DC voltage monitoring, including transients, and may be connected to external sensors. It requires external power. This project was funded by the RAMTIP Program Office at WPAFB OH.
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