Silicon Wafer Advanced Packaging (SWAP). Multichip Module (MCM) Foundry Study. Version 2

reportActive / Technical Report | Accession Number: ADA237412 | Open PDF

Abstract:

MCM technology is crucial to maintaining the competitive position of the U.S. electronics industry - military and commercial. The driving force is performance, and MCM users will seek off-shore suppliers if capabilities are lacking. In the long term, low-cost overseas capabilities will make their way into the U.S. military market and put it at risk. The proven GE-HDI MCM technology was developed with combined government and Ge funding, and its chips first approach offers the lowest non-recurring cost. Rapid prototyping, high performance, and technology flexibility are characteristic, and the potential exists for extension to high-volume.

Author(s):
Mowatt, Larry ; Henry, Frank ; Avery, Mark ; Sadler, Porter ; Eskew, Mark
Author Organization(s):
TEXAS INSTRUMENTS INC DALLAS
Descriptive Note:
Final rept. Oct 90-Mar 91,
Supplementary Note:
Prepared in Cooperation with General Electric.
Pagination:
0244

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
Approved For Public Release; Distribution Is Unlimited.

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
SWAP001-AC
Contract/Grant Number(s):
MDA972-90-C-0045, $$ARPA ORDER-7549
Monitor Series:
DARPA
 Subject Terms
Joint Capability Areas:
JCA_5_Command and Control; JCA_4.6_Engineering; JCA_4.6.1_General Engineering; JCA_5.3_Planning; JCA_4.7.2_Installation Services; JCA_4.7_Base and Installations Support; JCA_2.1_Planning and Direction; JCA_2.1.1_Define and Prioritize Requirements; JCA_5.3.3_Develop Strategy; JCA_5.5_Direct; JCA_5.5.1_Communicate Intent and Guidance; JCA_5.6.1_Assess Compliance with Guidance; JCA_5.6_Monitor; JCA_5.2_Understand; JCA_5.2.3_Share Knowledge and Situational Awareness; JCA_1.2.3_Educating; JCA_5.5.2_Task; JCA_1.2.6_Concepts; JCA_4.3_Maintain; JCA_1.2.5_Lessons Learned; JCA_4.1_Deployment and Distribution
Modernization Areas:
Microelectronics; 5G; Space
Communities of Interest:
Advanced Electronics
Descriptor(s):
*MARKETING, LOW COSTS, CHIPS(ELECTRONICS), MODULAR CONSTRUCTION, COSTS, ELECTRONICS INDUSTRY, PACKAGING, WAFERS, FOUNDRIES, FORCE(MECHANICS), OVERSEAS, RISK, SILICON
Field(s)/Group(s):
Electrical and Electronic Equipment, Solid State Physics
Keyword(s):
*MULTICHIP MODULES, *SILICON WAFERS, FOUNDRY IMPLEMENTATION, PACKAGING
Report Date:
1991 Apr 08