Electronics Temperature Control,

reportActive / Technical Report | Accession Number: ADA089744 | Open PDF

Abstract:

The results of a preliminary study on thermal modeling and analysis of microcircuits are presented. Studies covering typical components mounting methods, bonding agent materials component spacing, and cooling concepts are described. Temperature profiles of substrates, component temperatures and thermal resistances are presented. It is shown that the use of moly tabs, sputtered beryllia and thermoelectric coolers can significantly reduce component temperature levels. Additionally, it is illustrated that thermal modeling can aid the circuit designer in the layout and preliminary design phases. Author

Author(s):
Pogson, J. T.
Author Organization(s):
BOEING CO SEATTLE WA
Pagination:
0065

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
D180-18492-1
 Subject Terms
Joint Capability Areas:
JCA_1.2_Force Preparation; JCA_1_Force Support; JCA_1.2.6_Concepts; JCA_5_Command and Control; JCA_5.3_Planning; JCA_3.2_Engagement; JCA_3_Force Application; JCA_3.2.1_Kinetic Means
Modernization Areas:
Microelectronics
Communities of Interest:
Energy and Power Technologies
Descriptor(s):
*ELECTRONICS, *COOLING, *TEMPERATURE CONTROL, *MICROCIRCUITS, MODELS, SUBSTRATES, PROFILES, THERMAL ANALYSIS, COOLING AND VENTILATING EQUIPMENT, THERMAL RESISTANCE, ADHESIVE BONDING, CURVES(GEOMETRY), THERMOELECTRIC COOLING
Field(s)/Group(s):
Electrical and Electronic Equipment, Air Conditioning, Heating, Lighting and Ventilating
Keyword(s):
Electronic temperature control, Thermal modeling
Report Date:
1975 Jan 01