Heterogeneous Integration Technology

reportActive / Technical Report | Accession Number: AD1035357 | Open PDF

Abstract:

This report provides a review of the heterogeneous integration of different types of devices and materials for the purpose of increasing the functional density and the performance of electro-optic systems for sensor applications.

Author(s):
Bayraktaroglu, Burhan
Author Organization(s):
AFRL WPAFB United States
Descriptive Note:
Technical Report
Pagination:
0137

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
Approved For Public Release;

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
AFRL/RYDD
 Subject Terms
Joint Capability Areas:
JCA_1.2.6_Concepts; JCA_5_Command and Control; JCA_5.3_Planning; JCA_JCA_4.1.2_Sustain the Force; JCA_4.1_Deployment and Distribution; JCA_4.3_Maintain; JCA_5.4_Decide
Modernization Areas:
Microelectronics
Communities of Interest:
Advanced Electronics
Descriptor(s):
microelectromechanical systems, field effect transistors, electronics industry, modules (electronics), monolithic microwave integrated circuits, fabrication, thin film transistors, heterojunction bipolar transistors, three dimensional integrated circuits, circuit boards, SYSTEM ON CHIP, integrated systems, detectors, power electronics, mobile phones
Field(s)/Group(s):
Electrical and Electronic Equipment
Keyword(s):
Heterogeneous Integration, 3D Integration, sip(system in package), sensor integration
Report Date:
2017 May 19
Creation Date:
2018 Feb 06