SMD Soldering Technology Development at Government Systems Operations, Control Data Corporation,

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Abstract:

A general discussion dealing with the design for manufacturability and manufacturing of surface mount assemblies will be addressed, including the development of the soldering of surface mount leadless, and fine-pitch, high-lead-count, gull wing chip carriers. Product design and manufacturing processes are predominantly driven to meet the requirements for advanced military computers. SMD soldering technology developed with the Navys sponsored program, CIRCUIT CARD ASSEMBLY AND PROCESSING SYSTEM CCAPS, methodology.

Author(s):
Pai, Deepak K.
Author Organization(s):
CONTROL DATA CORP MINNEAPOLIS MN GOVERNMENT SYSTEMS MFG DIV
Supplementary Note:
This article is from 'Electronics Manufacturing Seminar Proceedings (11th Annual) Held in China Lake, California on 18-20 February 1987,' AD-A179 778, p491-527.
Pagination:
0036

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Subject Terms
Communities of Interest:
Materials and Manufacturing Processes
Descriptor(s):
*SOLDERING, *PRINTED CIRCUIT BOARDS, CHIPS(ELECTRONICS), MANUFACTURING, ASSEMBLY, RELIABILITY(ELECTRONICS), SOLDERING FLUXES, SELECTION, CONTROL
Field(s)/Group(s):
Manufacturing and Industrial Engineering and Control of Production Systems, Couplers, Fasteners and Joints
Keyword(s):
Component Reports, Surface mounted devices, J leads, VLSI(Very Large Scale Integration)
Report Date:
1987 Feb 01