Improving SMT (Surface Mount Technology) Circuit Board Inspection with 3D Vision,
Abstract:
Automated inspection has been a topic of great interest for the past several years, particularly when it addressed surface mount technology SMT. While SMT makes smaller, lighter, more capable products possible, SMT also makes assembling circuits more challenging. With closer contact spacings, complex device packages, and many contacts under the devices themselves, automated SMT assembly has become a necessity. Robots or dedicated machines place components automatically on substrates. In turn, these substrates are wave or reflow soldered with automated equipment. However, inspection automation has not kept up with progress in automated component placement and soldering. This paper explores the reasons for the lag in automating inspection, and suggests a solution using 3D vision and quantitative quality models similar to those used by inspection personnel. Author