Method of Joining Diamond Structures.

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Abstract:

This invention relates to diamond materials and more particular to methods of bonding diamond pieces together. Diamond is the ideal material for a large number of applications. Diamond is highly transparent to infrared radiation IR and radar, has the highest known heat conductivity, highest known hardness, produces little friction, does not conduct electricity, etc. Thus, diamond has properties that make it desirable as structural material for many applications, including radomes. Patent applications.

Author(s):
Kabacoff, Lawrence T. ; Barkyoumb, John
Author Organization(s):
DEPARTMENT OF THE NAVY WASHINGTON DC
Descriptive Note:
Patent Application, Filed 8 Jul 91,
Pagination:
0011

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
PAT-APPL-726 483
 Subject Terms
Communities of Interest:
No COI(s) Identified
Descriptor(s):
BONDING, CONSTRUCTION MATERIALS, DIAMONDS, ELECTRICITY, FRICTION, INFRARED RADIATION, JOINING, MATERIALS, PATENT APPLICATIONS, RADAR, RADOMES, STRUCTURES, THERMAL CONDUCTIVITY, TRANSPARENCE
Field(s)/Group(s):
Inorganic Chemistry
Report Date:
1991 Jul 08