Method for Providing Glass Substrates with a Solderable Coating.

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Abstract:

The patent application relates to a method for improving the solderability of a fused metal coated glass surface by electrodepositing a plating of nickel to said coated surface from a neutral pH plating solution followed by the electrodeposition of a plating of copper to the surface of the nickel plate.

Author(s):
Svejkovsky, Donald L.
Author Organization(s):
DEPARTMENT OF THE AIR FORCE WASHINGTON D C
Descriptive Note:
Patent Application,
Pagination:
0011

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
This Government-owned Invention Available For U.s. Licensing And, Possibly, For Foreign Licensing. Copy Of Application Available Ntis.

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
PAT-APPL-649 760
 Subject Terms
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*Metal coatings, Patents, Electroplating, Nickel, Copper, Glass, Substrates, Soldering
Field(s)/Group(s):
Coatings, Colorants and Finishes
Keyword(s):
*Patent applications, PAT CL 427 419
Report Date:
1976 Jan 16