Enhancing Tensile Response of Sn Using Cu at Nano Length Scale and High Temperature Extrusion

reportActive / Technical Report | Accession Number: ADA535905 | Open PDF

Abstract:

In the present study, 1.1 volume percent of nano size copper was incorporated into pure tin using hybrid microwave sintering assisted powder metallurgy route. Microwave sintered samples were extruded both at room temperature and at 230 degrees C. Microstructural characterization studies were conducted on the extruded samples to investigate the distribution characteristics of secondary phase and grain morphology. Room temperature tensile test results revealed that hot extruded Sn-Cu samples exhibited higher strengths 41, in case of 0.2 yield strength and 38, in case of ultimate tensile strength and ductility 15 when compared to room temperature extruded samples. On the contrary, the tensile properties of pure tin remained independent of extrusion temperature. An attempt is made in this study to correlate the effect of extrusion temperature on the microstructural evolution and tensile properties of Sn-Cu solder.

Author(s):
Alam, M. E. ; Gupta, M.
Author Organization(s):
NATIONAL UNIV OF SINGAPORE
Descriptive Note:
Conference paper
Supplementary Note:
See also ADM002300. Presented at the Minerals, Metals and Materials Annual Meeting and Exhibition (138th)(TMS 2009) held in San Francisco, California on 15-19 February 2009. Published in the Proceedings of the Minerals, Metals and Materials Annual Meeting and Exhibition (138th)(TMS 2009), p661-668, 2009. Sponsored in part by the U.S. Navy. U.S. Government or Federal Purpose Rights.
Pagination:
0009

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
Approved For Public Release; Distribution Is Unlimited.

RECORD

Collection: TR
Identifying Numbers
Monitor Series:
XD
 Subject Terms
Joint Capability Areas:
JCA_1.2_Force Preparation; JCA_1_Force Support; JCA_4.6_Engineering; JCA_5_Command and Control; JCA_8_Building Partnerships
Communities of Interest:
Energy and Power Technologies
Descriptor(s):
*EXTRUSION, *HIGH TEMPERATURE, *POWDER METALS, SYMPOSIA, TENSILE PROPERTIES, COPPER COMPOUNDS, DUCTILITY, TIN COMPOUNDS, GRAIN STRUCTURES(METALLURGY), SINTERING, SOLDERING ALLOYS, SINGAPORE, NANOTECHNOLOGY, NANOSTRUCTURES, MICROSTRUCTURE, SCANNING ELECTRON MICROSCOPY, THERMAL PROPERTIES, TENSILE STRENGTH
Field(s)/Group(s):
Properties of Metals and Alloys, Fabrication Metallurgy, Mechanics, Thermodynamics
Keyword(s):
FOREIGN REPORTS, PM(POWDER METALLURGY), FESEM(FIELD EMISSION SCANNING ELECTRON MICROSCOPY)
Report Date:
2009 Feb 01
Creation Date:
2011 Feb 16