Stress/Failure Analysis Software for Multi-Material Interfaces

The objective of the project was to provide means for establishing reliable quantitative failure initiation criteria for multiple chip modules MCMs, electronic packages, laminated composites and adhesively bonded joints. During Phase I, an easy-to-use, reliable and robust software was developed, with a graphic user interface, based on the innovative methods for the computation of generalized fluxstressthermal intensity factors GFIFsGSIFs TSIFs and the strength of the singularities for any multi-material interface problem involving isotropic or anisotropic materials, subject either to mechanical or thermal loading, in a two-dimensional setting. The existing software product Stress Check provided the framework for this development. Stress Check is based on the p- and hp-version of the finite element method, capable of a-posteriori error estimation in terms of the data of interest.