Methodology, Tools and Demonstration of MCM System Optimization

reportActive / Technical Report | Accession Number: ADA328732 | Open PDF

Abstract:

Thin filmsolder-bump packaging can be used to improve integrated circuit performance and cost. In this project we 1 designed and built a DES chip to demonstrate the advantages and 2 developed design methodology to support this design style, including appropriate CAD tools.

Author(s):
Franzon, Paul D.
Author Organization(s):
NORTH CAROLINA STATE UNIV AT RALEIGH
Descriptive Note:
Final rept.
Supplementary Note:
DOI: 10.21236/ADA328732
Pagination:
0006

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
ARO-32570.10-EL
Contract/Grant Number(s):
DAAH04-94-G-0003
Monitor Series:
32570.10-EL, ARO
 Subject Terms
Joint Capability Areas:
JCA_5_Command and Control
Modernization Areas:
Microelectronics
Communities of Interest:
Advanced Electronics
Descriptor(s):
*INTEGRATED CIRCUITS, *FLIP CHIPS, COMPUTER AIDED DESIGN, THIN FILMS, COMPUTER ARCHITECTURE, CENTRAL PROCESSING UNITS, PACKAGED CIRCUITS
Field(s)/Group(s):
Electrical and Electronic Equipment, Computer Hardware
Keyword(s):
MULTICHIP MODULES
Report Date:
1997 Jul 31
Creation Date:
1997 Sep 10