Thermal Management Research Studies. Volume 1. Electronics Cooling.

reportActive / Technical Report | Accession Number: ADA326973 | Open PDF

Abstract:

An innovative cooling concept called venturi flow cooling has been introduced and developed for potential use in the thermal management of the advanced high power electronic devices. Single phase cooling medium is effectively used to create very high velocities in localized region of interest to improve heat transfer. Several different test apparatus have been built to investigate the heat transfer and flow phenomena. Using the venturi flow system and water, power devices, such as MCT and IGBT, were successfully tested at their rated current and frequency levels never possible with other cooling methods. Heat flux up to 257 Wsq. cm and heat transfer coefficient up to 13 Wsq. cm. deg C were demonstrated in this cooling system. This cooling technique is highly recommended for the future electronic cooling applications of the emerging more electric airplane systems involving very high intensity localized heat dissipation devices. This report presents the detailed descriptions of all aspects of this project.

Author(s):
Ponnappan, Rengasamy
Author Organization(s):
QUESTECH INC DAYTON OH
Descriptive Note:
Final rept. Jun 91-Jan 96,
Pagination:
0152

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
UES-225-TR-96-1-VOL-1, WL*-TR-97-2011
Contract/Grant Number(s):
F33615-91-C-2104
Task Number(s):
20
Project Number(s):
3145
Monitor Series:
TR-97-2011, WL/WP
 Subject Terms
Communities of Interest:
Advanced Electronics
Descriptor(s):
*LIQUID COOLING, COMPUTER PROGRAM DOCUMENTATION, WATER FLOW, HIGH VELOCITY, DISSIPATION, THERMAL CONDUCTIVITY, TEMPERATURE CONTROL, HEAT FLUX, HEAT SINKS, HEAT TRANSFER COEFFICIENTS, LOAD CELLS, VENTURI TUBES
Field(s)/Group(s):
Electrical and Electronic Equipment, Air Conditioning, Heating, Lighting and Ventilating
Keyword(s):
*ELECTRONICS COOLING, VENTURI COOLING CONCEPT, HIGH VELOCITY FLOW, LOCALIZED HEAT DISSIPATION, CONTACT RESISTANCE, MCT(METAL OXIDE SEMICONDUCTOR CONTROLLED THYRISTOR), IGBT(INSULATED GATE BIPOLAR TRANSISTOR), PE62203F, WUWL31452000
Report Date:
1996 Nov 18
Creation Date:
1997 Jul 23