High Thermal Conductivity Graphite Electronic Components.

This project will apply high thermal conductivity graphite to three major spacecraft electronic components 1 the thermal plane of a printed wiring board, 2 the subassembly or tray that holds the board, and 3 the equipment panel that the tray mounts on. The complete heat transfer path from chip level heat source to radiative rejection on the exterior surface of the equipment panel will therefore be addressed. Thermal and structural requirements representative of current spacecraft will drive an optimized solution strategy. The project will be completed by fabricating the three prototypical test articles and measuring their performance in a representative space environment.