Cryogenic/High Temperature Structural Adhesives.

reportActive / Technical Report | Accession Number: ADA307453 | Open PDF

Abstract:

This Final Report describes the work performed during this program to develop a structural adhesive system which possesses useful properties over a 20 deg K -423 deg F to 589 deg K 600 deg F temperature range. Adhesives systems based on polyimide, polyphenylquinoxaline polyquinoxaline, polybenzothiazole and polybenzimidazole polymers first were screened for suitability. Detailed evaluation of two polyimide adhesive systems, BR34FM34 and P4A5F or P4AA5FA, and one polyphenylquinoxaline adhesive system, PPQ II IMW, then was performed. Property information was generated over the full temperature range for shear strength, stressed and unstressed thermal aging, thermal shock and coefficient of thermal expansion. Both polyimide adhesive systems were identified as being capable of providing structural adhesive joints for cryogenichigh temperature service.

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Subject Terms