Geometric Characterization of Electromigration Voids (A Statistical Analysis of Electromigration Voids)

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Abstract:

The areas, perimeters, lengths, and widths of 998 electromigration induced voids on 38 test stripes have been measured by SEM and digital image analysis. Virtually all of the voids occurred along the passivation-conductor interface on the side of the stripe. A plot of the number of voids on each stripe versus time to failure does not extrapolate to zero at zero time to failure, which suggests there are a certain number of active sites predisposed to voiding. Electromigration, Voids.

Author(s):
Kime, Yolanda J. ; Grach, Peter
Author Organization(s):
STATE UNIV OF NEW YORK COLL AT CORTLAND DEPT OF PHYSICS
Descriptive Note:
Final rept. Jun 1993-Sep 1994
Pagination:
0014

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release, Document Partially Illegible
Distribution Statement:
Approved For Public Release; Distribution Is Unlimited. Document Partially Illegible.

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
RL*-TR-94-190
Contract/Grant Number(s):
F30602-93-C-0167
Task Number(s):
F4
Project Number(s):
2305
Monitor Series:
TR-94-190, RL/GRIFFISS
 Subject Terms
Joint Capability Areas:
JCA_5_Command and Control; JCA_5.3_Planning; JCA_6_Net Centric; JCA_2_Battlespace Awareness; JCA_2.2.1_Signals Collection; JCA_2.2_Collection; JCA_6.1_Information Transport
Modernization Areas:
Microelectronics
Communities of Interest:
Advanced Electronics
Descriptor(s):
*VOIDS, *MICROELECTRONICS, TEST AND EVALUATION, EXPERIMENTAL DATA, INTERFACES, WIDTH, ELECTRIC CURRENT, NORMAL DISTRIBUTION, STRIPES, FAILURE(ELECTRONICS), THERMAL STRESSES, STATISTICAL ANALYSIS, IMAGES, TEMPERATURE GRADIENTS, COMPARISON, NUCLEATION
Field(s)/Group(s):
Electrical and Electronic Equipment, Statistics and Probability
Keyword(s):
*ELECTROMIGRATION, PASSIVATION, PE61102F, WURL2305F4P3
Report Date:
1994 Oct 01