Reliability Without Hermeticity (RWOH) for Integrated Circuits (IC)
Abstract:
This effort establishes baseline performance data for an inorganic ceramic protective coating over integrated circuits in plastic packages. Severe and differentiating environmental stress testing demonstrated protection against humidity beginning to approach the protection offered by hermetic packaging. Advantages in size and weight are inherent in the technology.
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Approved For Public Release
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Approved For Public Release; Distribution Is Unlimited.
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Collection: TR