Liquid Cooled Heat Sink with Through Vias (LCHS)

reportActive / Technical Report | Accession Number: ADA281450 | Open PDF

Abstract:

A Liquid Cooled Heat Sink with Through Electrical Vias was designed fabricated and tested. The Heat Sink was designed for use in 3D stacks of high heat producing multichip modules. The report covers design considerations, the fabrication process and measured performance achieved A special section compares the Heat Sink performance to an equivalent diamond heat sink. A second special section discusses the economics of high volume production of the Heat Sink. Important performance results include 1 Power Density of 5OWcm2 with temperature rise of 15C. 2 100 thru vias per sq cm 3 Thickness of 1.25mm.

Author(s):
Eichelberger, Charles W. ; Kusior, J. P.
Author Organization(s):
INTEGRATED SYSTEM ASSEMBLIES CORP WOBURN MA
Descriptive Note:
Final rept. Dec 1992-Sep 1993
Supplementary Note:
DOI: 10.21236/ADA281450
Pagination:
0032

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
Approved For Public Release; Distribution Is Unlimited.

RECORD

Collection: TR
Identifying Numbers
Contract/Grant Number(s):
N00014-91-C-0219
Monitor Series:
ONR
 Subject Terms
Joint Capability Areas:
JCA_5.3_Planning; JCA_5_Command and Control
Communities of Interest:
Advanced Electronics
Descriptor(s):
*MODULES(ELECTRONICS), *HEAT SINKS, DENSITY, TEMPERATURE, THICKNESS, VOLUME, PRODUCTION, HEAT, POWER, ECONOMICS, LIQUIDS, FABRICATION, DIAMONDS
Field(s)/Group(s):
Electrical and Electronic Equipment, Air Conditioning, Heating, Lighting and Ventilating
Report Date:
1993 Sep 30