Materials Research for GHz Multi-Chip Modules

The goal of this program is to investigate new dielectrics, metals and processes for the fabrication and characterization of multi-chip modules MCM which hold the promise of excellent performance, cost and yield for high frequency MCMs. First, the processes for using noble metals gold and silver as the interconnection metallization in the module have been investigated. Noble metal process can have fewer processing steps particularly for gold than the equivalent copper process and are potentially lower cost, particularly when high reliability is important. The silver process has been developed so that the silver maintains its bulk conductivity highest of conventional metals and has low residual stress during high temperature processing. The commercialization of the silver process is being considered. Second, a unique adhesion material has been investigated and is currently being investigated for commercial use. We are in the process of evaluating the process and with n-Chip and transferring the technology to them.