An Overview of Multichip Modules

This report provides a high-level tutorial on the electronics packaging technology known as multichip modules MCMs. The terminology associated with MCM development is explained in words which can be understood by personnel who do not have a background in electronics packaging techniques. The technology is introduced with a brief synopsis of the MCM history and market, proceeding into an in-depth discussion of interconnect substrates, Known-good- die issues, chip attachment technologies, and testingrework methods. The report concludes with a look at the fledgling industry infrastructure that supports MCM development, the high-speed chips that are used in MCM designs, the software support required, and the future of MCMs. Although by no means a comprehensive treatment of these subjects, this report provides the basics essential to an understanding of current state-of-the-art high-density electronics packaging. This information should be particularly beneficial to personnel involved in the development of miniaturized signal and data processors.