Extruded Films From Modified Polypropylene Resin: Dielectric and Breakdown Studies

reportActive / Technical Report | Accession Number: ADA261382 | Open PDF

Abstract:

Thin films approximately 25 microns formed by melt-extruding polypropylene resin after it had been briefly exposed to a low-pressure, low- temperature, CF402 gas plasma had significantly increased dielectric breakdown strengths with very-little accompanying changes in dielectric properties.

Author(s):
Mammone, Robert J. ; Wade, Jr., William L. ; Binder, Michael
Author Organization(s):
ARMY LAB COMMAND FORT MONMOUTH NJ ELECTRONICS TECHNOLOGY AND DEVICES LAB
Descriptive Note:
Technical rept. Feb-Aug 1991
Pagination:
0011

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
Approved For Public Release; Distribution Is Unlimited.

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
SLCET-TR-91-29
Project Number(s):
1L1
Monitor Series:
ETDL
 Subject Terms
Joint Capability Areas:
JCA_3.2_Engagement; JCA_3_Force Application; JCA_5_Command and Control; JCA_3.2.1_Kinetic Means
Modernization Areas:
Microelectronics
Communities of Interest:
Advanced Electronics
Descriptor(s):
*EXTRUSION, *POLYPROPYLENE, *PLASTICS, TEMPERATURE, LOW TEMPERATURE, PLASMAS(PHYSICS), LOW PRESSURE, CAPACITORS, DIELECTRIC PROPERTIES, GASES, MELTS, ENERGY, THIN FILMS
Field(s)/Group(s):
Physical Chemistry, Polymer Chemistry, Electricity and Magnetism, Plasma Physics and Magnetohydrodynamics
Keyword(s):
BREAKDOWN STRENGTHS, PE61102A, WU08
Report Date:
1992 Apr 01