Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies

This Final Technical Report is comprised of six basic sections. The first section is an overall description of the objectives and goals of the Electronic Manufacturing Process Improvement EMPI for Printed Wiring Assemblies PWAs Program. Included is a description of the PWA design, continuous process improvement, and the basic seven experiment approach. The second section is a summary of the results 8e achieved during the performance of the contract. Section 3 presents the activities performed and the results obtained during the interval between Technical Report Task No. 3 and the end of the program. Section 4 identifies the priorities of the tasks TRW will perform as indicated by the results achieved during this program. These tasks will be run by reentering the continuous process improvement cycle. Section 5 presents a list of lessons learned as a result of experience gained while performing the experiments designed for this program. Appendix A, B, C, and D to this report contain the detailed experimental plans for two single point experiments solder paste placement and component placement, a final, full factorial experiment, and a final confirmation run.