Fabrication of an Insulated Gate Diamond FET for High Temperature Applications
Abstract:
A type IIa natural diamond was implanted with boron to form a p-type channel layer. This layer was then used to fabricate an insulated gate field effect transistor. This is the first reported use of ion implantation to successfully fabricate a field effect device in diamond. Testing was carried out from room temperature to 550 K. Both saturation and pinch-off were observed at room temperature, with a measured transconductance of 6.9 micron Smm. Device failures at elevated temperatures were attributed to gate current leakage through the SiO2, insulator layer.
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