Double-Sided Wafer Alignment Techniques

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Abstract:

A project was undertaken by the Harry Diamond Laboratories to develop a double-sided wafer alignment technique by which special-purpose devices could be fabricated using in-house equipment. The approach developed was inexpensive and did not require infrared alignment methods for viewing through the wafer. A double-sided alignment technique with two different accuracies was developed for use on an ordinary optical mask aligner. These methods were highly successful and are in active use today.

Author(s):
Mermagen, Timothy J. ; Geil, Bruce R.
Author Organization(s):
HARRY DIAMOND LABS ADELPHI MD
Descriptive Note:
Final rept. 17 Oct 1990-1 Feb 1991,
Supplementary Note:
DOI: 10.21236/ADA250757
Pagination:
0014

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
Approved For Public Release; Distribution Is Unlimited.

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
HDL-TM-92-5
Monitor Series:
NSWC
 Subject Terms
Joint Capability Areas:
JCA_5_Command and Control; JCA_3.2_Engagement; JCA_3_Force Application; JCA_6_Net Centric; JCA_6.1.3_Switching and Routing; JCA_3.2.1_Kinetic Means; JCA_5.2_Understand; JCA_8_Building Partnerships
Modernization Areas:
Microelectronics
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*SOLID STATE ELECTRONICS, *MANUFACTURING, MASKS, APPROACH, ALIGNMENT, WAFERS
Field(s)/Group(s):
Manufacturing and Industrial Engineering and Control of Production Systems, Electricity and Magnetism, Solid State Physics
Keyword(s):
PE62120A
Report Date:
1992 Apr 01