Vapor Deposition of Polyimide and Polyimide Precursors on Copper

reportActive / Technical Report | Accession Number: ADA225729 | Open PDF

Abstract:

In this article we describe experiments in which ultra-thin films of polyimide were formed on polycrystalline and 111 single crystal copper substrates following heating of a vapor deposited layer of polyamic acid produced by codeposition of 4,4-diaminodiphenyl ether ODA and 1,2,4,5- benzenetetracarboxylic dianhydride PMDA. The adsorption of the pure components and their subsequent polymerization was followed, in situ, with X-ray photoelectron spectroscopy. Molecular adsorption of the monomers was studied to determine their thermal stability. The composition and adhesion of the thin polyimide film is influenced by fragmentation of precursors at the interface. Keywords Adhesion, Vapor deposition, Polyimide films, X-ray photoelectron spectroscopy.

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