Mechanical Properties of Microelectronics Thin Films: Silicon Nitride (Si3N4)

reportActive / Technical Report | Accession Number: ADA225394 | Open PDF

Abstract:

Mechanical design of microfabricated devices requires knowledge of mechanical material properties. Thin film material properties are sensitively process dependent, and should therefore be organized accordingly. A relational database of material properties is under development as part of a general micro- electro-mechanical computer aided design environment. A computerized literature search through the published values for Silicon Nitride Si3N4 properties under various processing conditions resulted in the following document. Keywords Micromechanical analysis, Deformable structures.

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