Manufacturing Methods and Technology for Digital Fault Isolation of Hybrid Microelectronic Assemblies.

The HFI program objective was to establish the test and fault isolation requirements for complex digital, hybrid microelectronic assemblies DHMAs of present, and future, production missile electronics. High production rate test and fault isolation of DHMAs, would use a single probe Autoprobe or AP automated for X, Y, Z position, and operating under bus control of an external host computer of ATE system. Project R1023 hardware HW and software SW were also to be compatible with the ATE system HW and SW previously delivered to MICOM under project R783242. Work Accomplished Digital Hybrid Microelectronic Assembly DHMA Survey Autoprobe Positioner Survey Positioner AP Adaptation HFI Autoprobe System Overview Autoprobe Interface Software Elements Test Candidate Hardware Test Software HFI Autoprobe System Data and Performance.