Research in VLSI Systems.

reportActive / Technical Report | Accession Number: ADA127153 | Open PDF

Abstract:

This report summarizes progress on VLSI Very Large Scale Integration Systems Research Projects from November 1981 to April 1983, inclusive. The major areas under investigation have included analysis and synthesis design aids, applications of VLSI, special purpose chip design, VLSI computer architectures, signal processing algorithms and architectures, reliability studies, hardware specification and verification, VLSI theory, and VLSI fabrication. The major research problems are introduced and progress is discussed the Appendix contains a list of published research papers from these projects. Author

Author(s):
Hennessy, John ; Matthews, R. ; Newkirk, J. ; Shott, J. ; Ullman, J.
Author Organization(s):
STANFORD UNIV CA DEPT OF COMPUTER SCIENCE
Descriptive Note:
Technical status rept. Nov 82-Apr 83,
Supplementary Note:
Sponsored in part by Contract MDA903-80-C-0432.
Pagination:
0020

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Contract/Grant Number(s):
MDA903-79-C-0680, MDA903-80-C-0107
 Subject Terms
Joint Capability Areas:
JCA_4.6_Engineering; JCA_4.6.1_General Engineering; JCA_5_Command and Control; JCA_5.3_Planning; JCA_6.1.3_Switching and Routing; JCA_1_Force Support; JCA_6_Net Centric; JCA_6.1.1_Wired Transmission; JCA_1.2_Force Preparation; JCA_5.3.3_Develop Strategy; JCA_6.1_Information Transport; JCA_1.2.3_Educating; JCA_1.4.2_Health Service Delivery; JCA_1.4_Force Support; JCA_1.2.7_Experimentation; JCA_5.2.2_Develop Knowledge and Situational Awareness; JCA_5.2_Understand; JCA_8.2.1_Partner with Governments and Institutions; JCA_8.2_Shape; JCA_8_Building Partnerships
Modernization Areas:
Microelectronics; Quantum Science and Computing
Communities of Interest:
Advanced Electronics
Descriptor(s):
*COMPUTER AIDED DESIGN, *CHIPS(ELECTRONICS), *INTEGRATED CIRCUITS, ALGORITHMS, SIGNAL PROCESSING, SPECIFICATIONS, COMPUTER ARCHITECTURE, FABRICATION, MEMORY DEVICES, LITHOGRAPHY, CIRCUIT INTERCONNECTIONS, ROUTING, WAFERS, RELIABILITY(ELECTRONICS)
Field(s)/Group(s):
Electrical and Electronic Equipment, Computer Hardware
Keyword(s):
VLSI(Very Large Scale Integration), LPN DARPA Order 3709
Report Date:
1983 Apr 01