A Synergistic Solution to the Problem of Packaging and Interconnecting VLSI/VHSIC Chips.

Solutions are required for the many problems faced by the chip packaging and interconnection systems industry for effectively meting the demanding application requirements of the rapidly emerging very-large scale integrationvery-high speed integrated circuits VLSIVHSIC chips. Present packaging technologies are being stretched beyond their original concepts thus requiring a new approach to the problem solution. The Military Electronics Systems Operations MESO has developed a new packaging approach, based on the Direct Bond Copper Process, which addressed these problems providing a completely integrated system. The problem solution starts at the chip level where en masse connections are made to the chip, chip heat is more effectively managed, low-cost chip hermetic seals accomplished, and then continues providing improved means for interconnecting many VLSIVHSIC chips. Author