Thick-Film Fine Line Printing.

reportActive / Technical Report | Accession Number: ADA053010 | Open PDF

Abstract:

This report discusses the significant parameters in fine line printing less than 0.005 lines and spaces of thick-film microelectronic circuits. This considerations of the materials, substrate, paste rheology and the interaction of the elements in the manufacturing process are reported. The documented results of the experimental work are presented demonstrating 3-mil lines and spaces. The yield is presented as a function of line spacing, width, and length. The conclusions include process parameters to duplicate the results. Author

Author(s):
Ruwe, Victor W. ; Dean, Kenneth ; Sulouff, Robert E.
Author Organization(s):
ARMY MISSILE RESEARCH AND DEVELOPMENT COMMAND REDSTONE ARSENAL AL ENGINEERING LAB
Descriptive Note:
Final rept.,
Pagination:
0022

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
DRDMI-E-78-1
Project Number(s):
1W362303A214
 Subject Terms
Joint Capability Areas:
JCA_1.2.5_Lessons Learned; JCA_3.2_Engagement; JCA_3_Force Application; JCA_3.2.1_Kinetic Means; JCA_5_Command and Control; JCA_8.2.4_Leverage Capacities and Capabilities of Security Establishments; JCA_8.2_Shape; JCA_8_Building Partnerships
Modernization Areas:
Microelectronics
Communities of Interest:
Advanced Electronics
Descriptor(s):
*INTEGRATED CIRCUITS, *MICROELECTRONICS, *THICK FILMS, RHEOLOGY, PRINTING, PASTES, LINES(GEOMETRY)
Field(s)/Group(s):
Electrical and Electronic Equipment, Solid State Physics
Keyword(s):
AS214, PE62303A
Report Date:
1977 Sep 01