Pitting in Aluminum.

reportActive / Technical Report | Accession Number: ADA049854 | Open PDF

Abstract:

Observations by electron microscopy of transient pitting during film growth in the passive state were extended to a lower potential. Electrochemical studies in sulfuric acid of the effect on cathode behavior of copper contents from 0.1 to 600 ppm showed that cathode polarization decreases with time, that corrosion potential rises with time and that the effect is accelerated by chloride additions and can be substantial even at 1 ppm Cu. It is proposed that the formation of cathodes of copper during corrosion occurs in transient pits. Author

Author(s):
Metzger, M.
Author Organization(s):
ILLINOIS UNIV AT URBANA-CHAMPAIGN DEPT OF METALLURGY AND MINING ENGINEERING
Descriptive Note:
Final rept. 1 Sep 75-30 Sep 76,
Supplementary Note:
DOI: 10.21236/ADA049854
Pagination:
0004

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
ARO-12821.2-MS
Contract/Grant Number(s):
DAAG29-76-G-0039
Task Number(s):
04
Project Number(s):
1T161102BH57
Monitor Series:
12821.2-MS
 Subject Terms
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*CORROSION, *ALUMINUM ALLOYS, *CATHODES, *PITTING, POLARIZATION, FILMS, ELECTROCHEMISTRY, COPPER, SULFURIC ACID
Field(s)/Group(s):
Physical Chemistry, Properties of Metals and Alloys
Keyword(s):
PE61102A, ASH57
Report Date:
1977 Aug 19