The Effects of Substrate Composition on Thick Film Circuit Reliability.

reportActive / Technical Report | Accession Number: ADA048890 | Open PDF

Abstract:

The initial stage sintering kinetics for lead borosilicate glasses were studied in order to determine the effect of substrate dissolution in the glass on the surface tension to viscosity ratio. Substrate additions up to 10 weight percent decreased the magnitude of this ratio by a factor of 10 but left its temperature dependence unchanged. Thick film resistors were fabricated with and without substrate dissolved in the resistor glass, and differences up to a factor of 100 were found in both the magnitude and temperature dependence of the sheet resistance. Author

Author(s):
Vest, R. W.
Author Organization(s):
PURDUE RESEARCH FOUNDATION LAFAYETTE IND
Descriptive Note:
Quarterly rept. no. 3, 1 Aug 77-31 Oct 77,
Pagination:
0028

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Contract/Grant Number(s):
N00019-77-C-0327
 Subject Terms
Joint Capability Areas:
JCA_8.1_Communicate; JCA_8_Building Partnerships; JCA_8.1.1_Inform Domestic and Foreign Audiences; JCA_8.1.3_Influence Adversary and Competitor Audiences; JCA_1.2.7_Experimentation
Modernization Areas:
Microelectronics
Communities of Interest:
Advanced Electronics
Descriptor(s):
*SUBSTRATES, *DISSOLVING, MICROSTRUCTURE, GLASS, ELECTRICAL PROPERTIES, IMPURITIES, ELECTRICAL CONDUCTIVITY, CERAMIC MATERIALS, SURFACE PROPERTIES, VISCOSITY, SINTERING
Field(s)/Group(s):
Electrical and Electronic Equipment, Solid State Physics
Keyword(s):
Dissolution, Electronic glass, Surface tension, *Thick film resistors
Report Date:
1977 Nov 30