Solderability Testing of Microcircuits.

reportActive / Technical Report | Accession Number: ADA041203 | Open PDF

Abstract:

Solderability tests were performed on Fe-Ni-Co and Fe-Ni microelectronic lead base materials with surface preparations as required by MIL-M-38510C. Test samples were used from four different sources. The solderability tests included MIL-STD-883A, Meniscograph and Hot Iron methods. Sample data from the three test methods showed good correlation. Microelectronic lead aging studies showed that the current steam aging environment should be retained. Author

Author(s):
Oehme, R. ; Schaefer, G. ; Ward, R. ; Zakraysek, L.
Author Organization(s):
GENERAL ELECTRIC CO UTICA N Y AEROSPACE ELECTRONIC SYSTEMS DEPT
Descriptive Note:
Final technical rept. 13 May 76-13 Mar 77,
Supplementary Note:
DOI: 10.21236/ADA041203
Pagination:
0057

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
RADC-TR-77-176
Contract/Grant Number(s):
F30602-76-C-0284
Task Number(s):
01
Project Number(s):
2338
Monitor Series:
TR-77-176
 Subject Terms
Joint Capability Areas:
JCA_6_Net Centric; JCA_4.2.3_Manage Global Supplier Networks; JCA_4.2_Supply; JCA_5_Command and Control; JCA_4.5.4_Requirements Definition; JCA_4.5_Operational Contract Support; JCA_6.1.1_Wired Transmission; JCA_6.1_Information Transport; JCA_1_Force Support; JCA_3.2_Engagement; JCA_3_Force Application; JCA_6.2.1_Information Sharing; JCA_6.2.2_Computing Services; JCA_6.2.3_Core Enterprise Services
Modernization Areas:
Microelectronics
Communities of Interest:
Advanced Electronics
Descriptor(s):
*MICROELECTRONICS, *MICROCIRCUITS, ACCEPTANCE TESTS, AGING(MATERIALS), SOLDERING, SOLDERING ALLOYS, SOLDERING FLUXES
Field(s)/Group(s):
Electrical and Electronic Equipment, Fabrication Metallurgy
Keyword(s):
Meniscograph soldering
Report Date:
1977 May 01