Semiconductor Measurement Technology

reportActive / Technical Report | Accession Number: ADA032167 | Open PDF

Abstract:

Contents Resistivity Physical analysis methods Test structure applications Materials and procedures for wafer processing Photolithography Test patterns Interconnection bonding Hermeticity Device inspection and test Thermal properties of devices References.

Author(s):
Bullis, W. Murray
Author Organization(s):
NATIONAL BUREAU OF STANDARDS WASHINGTON DC ELECTRONIC TECHNOLOGY DIV
Descriptive Note:
Progress rept. 1 Jul-31 Dec 1975
Supplementary Note:
Sponsored in part by Strategic Systems Project Office (Navy) , Washington, D.C., Space and Missile Systems Organization, Los Angeles, Calif., and Defense Nuclear Agency, Washington, D.C.
Pagination:
0092

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
Approved For Public Release; Distribution Is Unlimited.

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
NBS-SP-400-25
Contract/Grant Number(s):
ARPA ORDER-2397
Monitor Series:
DARPA
 Subject Terms
Joint Capability Areas:
JCA_5_Command and Control; JCA_5.3_Planning; JCA_5.5.2_Task; JCA_5.5_Direct; JCA_1.2.7_Experimentation; JCA_1.2.3_Educating; JCA_4.5.4_Requirements Definition; JCA_4.5_Operational Contract Support; JCA_1.2.5_Lessons Learned; JCA_1.2.6_Concepts; JCA_4.6_Engineering
Communities of Interest:
Advanced Electronics
Descriptor(s):
*QUALITY CONTROL, *SEMICONDUCTOR DEVICES, *SEMICONDUCTORS, *SURFACE PROPERTIES, AUGER ELECTRON SPECTROSCOPY, CHEMICAL ANALYSIS, DEFECTS(MATERIALS), DOPING, EXPERIMENTAL DESIGN, HERMETIC SEALS, INSTRUMENTATION, INTEGRATED CIRCUITS, MEASUREMENT, METAL OXIDE SEMICONDUCTORS, PHOTOLITHOGRAPHY, SAPPHIRE, SILICON, TEST FACILITIES, X RAY SPECTROSCOPY
Field(s)/Group(s):
Electrical and Electronic Equipment, Test Facilities, Equipment and Methods, Solid State Physics
Keyword(s):
X ray photoelectron spectroscopy
Report Date:
1976 Oct 01