Photolithographic Techniques for Surface Acoustic Wave (SAW) Devices.
Abstract:
The object of the program is the establishment of a production capability for surface acoustic wave devices of varied design and material for the purpose of meeting estimated military needs for a period of two years after the completion of the contract and to establish a base and plans which may be used to meet expanded requirements. The primary requirement is the pilot line production of devices that are reliable, reproducible, and low cost. The second phase of this program has required a finalization of six electrical specifications on bandpass, tapped delay line and pulse compression filter. Ten devices of each of the designs are currently being fabricated for shipment at the end of this phase. These devices will be packaged in semiconductor platform pin packages.