A New Ceramic Flat Pack for Quartz Resonators.

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Abstract:

The performance of quartz resonators is strongly dependent on the method of packaging. The stringent performance requirements imposed by moddern communication and navigation systems has necessitated the development of a family of microcircuit compatible quartz crystal units for which a new flat package configuration, a ceramic material, a new sealing technique, and novel mounting methods will be used. This report discusses the criteria used to arrive at the new package design. The package consists of a frame with a top and bottom lid. The frame is constructed by a multilayer ceramic technique, with buried layer metallization for the electrical connections. The ceramic currently being used is Al2O3 and the feedthrough metallization is tungsten. The package has low capacitance.

Author(s):
Wilcox, P. D. ; Snow, G. S. ; Hafner, E. ; Vig, J.
Author Organization(s):
ARMY ELECTRONICS COMMAND FORT MONMOUTH N J
Descriptive Note:
Technical rept.,
Supplementary Note:
Pub. in Proceedings of the Annual Symposium on Frequency Control (29th), May 1975.
Pagination:
0030

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
ECOM-4396, GIDEP-E053-1605
Project Number(s):
DA-1-S-762705-AH-94
Monitor Series:
E053-1605, 525.00.00.00-04-01
 Subject Terms
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*QUARTZ RESONATORS, CERAMIC MATERIALS, ALUMINUM OXIDES, PACKAGING, TUNGSTEN, HERMETIC SEALS, METALLIZING, CRYSTAL HOLDERS
Field(s)/Group(s):
Electrical and Electronic Equipment
Report Date:
1976 Apr 01