Reliability Study of Microwave Transistor Packaging.

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Abstract:

This report presents the results of a study to evaluate the influence of the package on the reliability of microwave power transistors. Emphasis in this study is placed on the effect of the package on the device reliability and not on the reliability of the package itself. This effort has consisted of a number of discrete study areas, which are related to each other only in that they all involve a different aspect of the reliability of the packaged device. They include a complex load plane study for the various available devices in which performance and junction temperature are defined over the complex load plane a study of the sensitivity of the device to wire movement, a characterization of the integrity of the available carriers and an epoxy seal evaluation. Several other related studies were carried out and are reported here. Author

Author(s):
Lacombe, Donald J. ; Naster, Ronald J.
Author Organization(s):
GENERAL ELECTRIC CO SYRACUSE N Y ELECTRONICS LAB
Descriptive Note:
Final technical rept. 21 Jan 74-21 Apr 75,
Supplementary Note:
Rept. no. GIDEP-742.20.00.00-F9-01.
Pagination:
0162

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
RADC-TR-75-292, GIDEP-E053-2241
Contract/Grant Number(s):
F30602-74-C-0128
Task Number(s):
551906
Project Number(s):
AF-5519
Monitor Series:
TR-75-292, E053-2241
 Subject Terms
Communities of Interest:
Air Platforms
Descriptor(s):
*POWER AMPLIFIERS, *TRANSISTOR AMPLIFIERS, *MICROWAVE AMPLIFIERS, TEMPERATURE, RADAR EQUIPMENT, COMPLEX NUMBERS, RELIABILITY(ELECTRONICS), LOADING(ELECTRONICS), PACKAGED CIRCUITS
Field(s)/Group(s):
Electrical and Electronic Equipment, Active and Passive Radar Detection and Equipment
Keyword(s):
AN TPS 59, Failure mechanisms
Report Date:
1975 Dec 01