Aluminum Ribbon and Round Wire Bonding: Comparative Analysis.

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Abstract:

Results are reported of an experimental program conducted to determine the benefits and problems involved in implementing ribbon wire bonding processes and techniques, and to establish the feasibility of converting from the conventional round-wire to ribbon ultrasonic bonding.

Author(s):
Unger, R. F.
Author Organization(s):
NAVAL ELECTRONICS LAB CENTER SAN DIEGO CALIF
Descriptive Note:
Research and development rept. Jan 73-Apr 74,
Pagination:
0095

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
NELC/TR-1946
Project Number(s):
NELC-R215
 Subject Terms
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*SEMICONDUCTOR DEVICES, *ULTRASONIC WELDING, WIRE, ALUMINUM, TAPES
Field(s)/Group(s):
Electrical and Electronic Equipment, Machinery and Tools
Report Date:
1975 Mar 05