NextFlex Flexible Hybrid Electronics Manufacturing

reportActive / Technical Report | Accession Number: AD1029424 | Open PDF

Abstract:

NextFlex, Americas Flexible Hybrid Electronics Manufacturing Innovation Institute, is a program formed out of a cooperative agreement awarded to the nonprofit FlexTech Alliance on Aug 28, 2015. NextFlex is the seventh manufacturing innovation institute created to scale up emerging technologies, foster American innovation, and establish a U.S. manufacturing base to accelerate transition into both defense and commercial products.

Author(s):
Leever, Benjamin J. ; Forsythe, Eric
Author Organization(s):
Army Research Laboratory Adelphi United States
Descriptive Note:
Journal Article
Supplementary Note:
Defense AT and L , 01 Jan 0001, 01 Jan 0001,
Pagination:
0005

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
Approved For Public Release;

RECORD

Collection: TR
Subject Terms
Joint Capability Areas:
JCA_6_Net Centric; JCA_1_Force Support; JCA_5_Command and Control; JCA_1.2_Force Preparation; JCA_1.2.3_Educating; JCA_5.5.1_Communicate Intent and Guidance; JCA_5.5_Direct; JCA_4.1_Deployment and Distribution; JCA_6.1_Information Transport; JCA_1.4.2_Health Service Delivery; JCA_1.4_Force Support; JCA_3.2_Engagement; JCA_3_Force Application
Modernization Areas:
Microelectronics; Autonomy
Communities of Interest:
Biomedical
Descriptor(s):
wearable technology, department of defense, military research, printed circuit boards, network protocols, printed circuits, monitoring, software design
Field(s)/Group(s):
Electrical and Electronic Equipment
Keyword(s):
Flexible Hybrid Electronics
Report Date:
2016 Oct 01
Creation Date:
2017 Jun 19