Thermal Isolation and Differential Cooling of Heterogeneously Integrated Devices

The challenges of thermally isolating heterogeneously integrated components from one another was investigated. This work introduces the concept of microspreading resistance as a component of the thermal behavior of arrays of conductive vias. Recommendations for mitigating microspreading when it is undesirable is provided, and a formalism for incorporating it into existing equivalent thermal conductivity models of via arrays. After examining several heterogeneous integration approaches, it was determined that a segregated chiplet approach offered the most promising avenue for thermal isolation efforts.