High Temperature Pressure Transducers.

First, David J.; Heller, Henry B.; Hurley, George F.; Pugmaire, John P.

High Temperature Pressure Transducers.

Active / Technical Report | Accession Number: AD0865429 |

Need Help?

Abstract:

This report describes work which was carried out toward the design and evaluation of a solid state transducer intended to operate from -50 to 350C and to sustain exposure to 450C. A flaw, partly affecting the fabrication and partly affecting the operation of the device was discovered in the use of silicon as both diaphragm and gauges. Another design approach is presented in which silicon gauges are bonded to a thin beam which is deflected by a metal diaphragm. Means of making high temperature electrical contacts to silicon are presented, as well as methods to join silicon to the structure. Data for the stability of the gauging system and contacts at elevated temperatures are given. Author

Author(s):

First, David J. ; Heller, Henry B. ; Hurley, George F. ; Pugmaire, John P.

Author Organization(s):

TYCO LABS INC WALTHAM MA

Descriptive Note:

Final rept. 3 Mar-15 Jul 69,

Pagination:

0055

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:

Approved For Public Release

RECORD

Collection: TR

Identifying Numbers

Report Number(s):

AFFDL-TR-69-108

Contract/Grant Number(s):

F33615-69-C-1483

Task Number(s):

822403

Project Number(s):

AF-8224

Monitor Series:

TR-69-108

Subject Terms

Modernization Areas:

Microelectronics

Communities of Interest:

Advanced Electronics

Descriptor(s):

*STRAIN GAGES, *PIEZOELECTRIC TRANSDUCERS, MANUFACTURING, ASSEMBLY, SILICON, BONDING, DETECTORS, DIAPHRAGMS(MECHANICS), RELIABILITY(ELECTRONICS)

Field(s)/Group(s):

Test Facilities, Equipment and Methods

Report Date:

1969 Dec 01