Thermal Parameters and Analytical-Experimental Procedures for Integrated Circuit Devices and Systems.

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Abstract:

Results of studies of thermal considerations in integral circuit IC devices and systems is presented. Covered are IC thermal parameters, thermal instrumentation and temperature measuring techniques, computer implemented thermal analyses, magnitudes of thermal gradients and thermal resistances, design considerations for a high dissipation-low thermal resistance IC package, IC package to sink thermal analyses, and an IC thermal alarm system. The information presented should be of use to both the user and the manufacturer of integrated circuits. Author

Author(s):
Plizak, B. T.
Author Organization(s):
NAVAL AIR DEVELOPMENT CENTER WARMINSTER PA AERO-ELECTRONIC TECHNOLOGY DEPT
Descriptive Note:
Phase rept.,
Pagination:
0099

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
NADC-AE-6849
Project Number(s):
A31533E02/2021/R0080301
 Subject Terms
Modernization Areas:
Microelectronics
Communities of Interest:
No COI(s) Identified
Descriptor(s):
(*INTEGRATED CIRCUITS, THERMAL ANALYSIS), MICROELECTRONICS, THERMAL PROPERTIES, HEAT RESISTANT MATERIALS, HEAT SINKS, INTERFACES, PRINTED CIRCUITS, TEMPERATURE WARNING SYSTEMS, FEASIBILITY STUDIES, HEAT TRANSFER
Field(s)/Group(s):
Electrical and Electronic Equipment, Thermodynamics
Report Date:
1969 May 05