THERMAL ASPECTS OF INTEGRATED CIRCUITRY.

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Abstract:

Contents Design Considerations for a High Dissipation-Low Thermal Resistance Integrated Circuit Package Integrated Circuit Device to Sink Thermal Analysis and Miniaturized Electronic Thermal Alarm.

Author(s):
Welling, J. R.
Author Organization(s):
MOTOROLA INC SCOTTSDALE AZ GOVERNMENT ELECTRONICS DIV
Descriptive Note:
Final rept.,
Supplementary Note:
Continuation of Contract N62269-2393.
Pagination:
0119

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
ACF-3171-1
Contract/Grant Number(s):
N62269-3498
 Subject Terms
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*INTEGRATED CIRCUITS, THERMAL PROPERTIES, ELECTRONIC EQUIPMENT, MOLYBDENUM, RARE GASES, BONDING, BERYLLIUM, COPPER, ELECTRICAL RESISTANCE, PRINTED CIRCUITS, MATHEMATICAL MODELS, WARNING SYSTEMS, MINIATURE ELECTRONIC EQUIPMENT, HEAT FLUX, THERMAL CONDUCTIVITY, THERMAL ANALYSIS, THERMAL INSULATION, CONFIGURATIONS, MICROWAVE EQUIPMENT, HEAT TRANSFER, SILICON, GOLD, PLATING, ALUMINUM, TEST METHODS
Field(s)/Group(s):
Electrical and Electronic Equipment, Thermodynamics
Keyword(s):
KOVAR METAL
Report Date:
1967 Dec 15