Processing Techniques for shock Resistance Precision Quartz Crystal Units.

Processing techniques were established for 20-22 MHz, plus or minus 3 ppm, 0C to 60C fundamental model quartz crystal units with tightly controlled equivalent circuit parameters and high shock resistance. Details for the processing techniques are presented, establishing means of assuring manufacturing repeatability, particularly during the more critical stages, e.g. edge conditioning of the crystal blanks, lapping and polishing to close tolerances, X-ray measurements, appropriate electroding and plateback, mounting and bonding procedures, frequency plating, bakeout cycle sealing procedures. Author