Silicon RF Power Transistor Metallization

reportActive / Technical Report | Accession Number: AD0730774 | Open PDF

Abstract:

The effects of high temperatures and high current densities on the physical properties of aluminum metallization on semiconductor devices were studied. In particular, this research was concerned with three possible failure modes of the metallization electromigration, interdiffusion of silicon and aluminum, and metallization reconstruction due to thermal cycling. Electromigration theories are discussed and an engineering curve predicting MTF for an Al-2 Cu alloy was obtained.

Author(s):
Hall, Edward L.
Author Organization(s):
MOTOROLA INC PHOENIX AZ SEMICONDUCTOR GROUP
Descriptive Note:
Final rept. 6 Jul 1970-31 May 1971
Pagination:
0110

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
Approved For Public Release; Distribution Is Unlimited.

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
L-58, ECOM-0164-F
Contract/Grant Number(s):
DAAB07-70-C-0164
Task Number(s):
1H662705A05601
Project Number(s):
DA-1-H-662705-A-056
Monitor Series:
0164-F, ECOM
 Subject Terms
Joint Capability Areas:
JCA_1.2.7_Experimentation; JCA_5_Command and Control; JCA_3.2_Engagement; JCA_3_Force Application; JCA_3.2.1_Kinetic Means; JCA_6.4.1_Secure Information Exchange; JCA_JCA_4.1.2_Sustain the Force; JCA_4.1_Deployment and Distribution; JCA_6_Net Centric; JCA_1.3_Human Capital Management; JCA_1_Force Support; JCA_1.3.2_Personnel Management; JCA_4.6_Engineering; JCA_6.4_Information Assurance
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*TRANSISTORS, DEFORMATION, ALUMINUM COATINGS, COPPER ALLOYS, RADIOFREQUENCY POWER, DIFFUSION, RELIABILITY(ELECTRONICS), ALUMINUM ALLOYS, SILICON
Field(s)/Group(s):
Electrical and Electronic Equipment, Coatings, Colorants and Finishes
Keyword(s):
*METALLIZING
Report Date:
1971 Oct 01