THE VACUUM DEPOSITION OF MOLYEDENUM-GOLD FILMS FOR SILICON CONTACT TECHNOLOGY,

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Abstract:

Contact systems for silicon devices are surveyed. A procedure for the vacuum deposition of composite Mo-Au film contacts on passivated silicon is described and critical parameters discussed. Bonding data and MOS capacitor properties are given. Author

Author(s):
Rich, E. C.
Author Organization(s):
ROYAL RADAR ESTABLISHMENT MALVERN (ENGLAND)
Pagination:
0013

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
RRE-TN-740
 Subject Terms
Modernization Areas:
Microelectronics
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*ELECTRIC CONNECTORS, *METAL FILMS, VAPOR PLATING, MOLYBDENUM, GOLD, VACUUM APPARATUS, SILICON, SILICON DIOXIDE, SUBSTRATES, UNITED KINGDOM
Field(s)/Group(s):
Electrical and Electronic Equipment, Fabrication Metallurgy
Report Date:
1969 Mar 01