BONDING OF FLUID AMPLIFIER SYSTEMS WITH A DRY-FILM ADHESIVE,

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Abstract:

The report describes an improved system for bonding and sealing fluid amplifiers. The principal feature of the new system is an experimental dry-film adhesive, which consists of a plastic support film coated with a nontacky epoxy resin adhesive this film is die-cut to shape and cured in place between the amplifier halves. A secondary feature is an adhesive gasket of a commercial foamable epoxy resin designed to seal the connector tubes in place. Bonding and sealing are done simultaneously, which also represents an advance in the state of the art. Author

Author(s):
Kilduff, Timothy J. ; Horsey, Eleanor F.
Author Organization(s):
HARRY DIAMOND LABS WASHINGTON D C
Pagination:
0027

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
HDL-TR-1419
Project Number(s):
DA-1-N-222901-A-207, HDL-96300
 Subject Terms
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*BONDING, SEALS(STOPPERS), FLUID AMPLIFIERS, ADHESIVES, DIES, FILMS, SHRINKAGE, SOLVENTS, PAPER, POLYETHYLENE PLASTICS
Field(s)/Group(s):
Fluidics and Fluerics, Adhesives, Seals and Binders
Report Date:
1968 Oct 01