TECHNOLOGY FEASIBILITY SPACECRAFT (TFS), TECHNOLOGY REPORT. VOLUME I. ELECTRONIC PACKAGING.

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Abstract:

An electronic packaging program was initiated to develop and evaluate integrated circuit packaging techniques applicable to unmanned scientific spacecraft data systems. This was accomplished by a design, develop and demonstrate approach through engineering, manufacturing, and testing for a space environment. Author

Author(s):
Parham, L.
Author Organization(s):
MARTIN MARIETTA CORP DENVER COLO DENVER DIV
Descriptive Note:
Final rept.,
Supplementary Note:
See also Volume 2, AD-670 722, Volume 3, AD-670 723, and Volume 4, AD-670 724.
Pagination:
0323

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
R-68-2-Vol-1
 Subject Terms
Modernization Areas:
Autonomy
Communities of Interest:
Space
Descriptor(s):
*SPACECRAFT, *INTEGRATED CIRCUITS, *PACKAGED CIRCUITS, PACKAGING, PRINTED CIRCUITS, SCIENTIFIC SATELLITES, LOGIC CIRCUITS, MANUFACTURING, DETECTORS, DIGITAL TO ANALOG CONVERTERS, DIAGRAMS
Field(s)/Group(s):
Electrical and Electronic Equipment, Unmanned Spacecraft
Keyword(s):
*TECHNOLOGY FEASIBILITY SPACECRAFT
Report Date:
1967 Oct 01